What is Cu clip package? copper tank

Power chips are connected to exterior circuits through packaging, and their efficiency depends upon the assistance of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation refers to the electric connection on the top surface area of the chip, which is usually light weight aluminum bonding cord in typical components. ^
Conventional power component bundle cross-section

At present, business silicon carbide power components still mainly make use of the packaging technology of this wire-bonded standard silicon IGBT component. They face problems such as large high-frequency parasitical criteria, insufficient heat dissipation capacity, low-temperature resistance, and not enough insulation stamina, which limit using silicon carbide semiconductors. The display of outstanding performance. In order to solve these issues and totally exploit the massive possible benefits of silicon carbide chips, many new product packaging innovations and options for silicon carbide power components have emerged over the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have created from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold wires to copper wires, and the driving pressure is cost reduction; high-power tools have established from aluminum cords (strips) to Cu Clips, and the driving force is to improve product performance. The higher the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared with conventional bonding product packaging techniques, Cu Clip technology has the adhering to benefits:

1. The link in between the chip and the pins is made from copper sheets, which, to a particular level, replaces the common wire bonding method between the chip and the pins. For that reason, a distinct package resistance value, greater current flow, and far better thermal conductivity can be acquired.

2. The lead pin welding area does not require to be silver-plated, which can fully save the expense of silver plating and poor silver plating.

3. The item appearance is completely regular with typical products and is primarily made use of in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.

Cu Clip has 2 bonding methods.

All copper sheet bonding method

Both eviction pad and the Source pad are clip-based. This bonding method is much more costly and complicated, however it can attain better Rdson and far better thermal impacts.

( copper strip)

Copper sheet plus cable bonding method

The resource pad utilizes a Clip approach, and eviction utilizes a Wire technique. This bonding technique is slightly cheaper than the all-copper bonding technique, conserving wafer location (applicable to very small entrance areas). The procedure is easier than the all-copper bonding technique and can obtain far better Rdson and better thermal effect.

Provider of Copper Strip

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